According to media reports, it was learned from a number of insiders that BYD is planning to independently develop smart driving dedicated chips. The project, led by BYD semiconductor team, has issued demands to the design company and is also recruiting BSP technical team.
The report quoted sources as saying that if the progress is fast, the chip can be released by the end of the year. BSP is a board support package, which is used to provide a standard interface for the operating system running on the chip. Industry insiders said that it is not uncommon to start chip research and development from BSP.
BYD has not responded to the above information.
BYD‘s semiconductor team has been established for nearly 20 years. It was separated and independent in 2020, and submitted a prospectus to the Shenzhen Stock Exchange to seek listing. At present, BYD‘s semiconductor products are mainly electronic control and industrial chips such as IGBT and MCU, but it has not been involved in intelligent driving chips and digital cockpit chips. In China, Weilai, Xiaopeng automobile and ideal automobile have established a huge intelligent driving R & D team, and Weilai and Xiaopeng have also established a chip R & D team.
On June 8 this year, BYD chairman Wang Chuanfu said bluntly at the shareholders‘ meeting, "the first half of new energy vehicles is electrification, and the second half is intelligence. In the field of intelligence, BYD will connect all core technologies and fully verify them, just like in the field of electrification."
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