Source: aijiwei
Recently, according to the Zhuhai Special Zone News, the Zhuhai Yuexin semiconductor high-end RF and FCBGA packaging carrier board production and manufacturing project (hereinafter referred to as "Zhuhai Yuexin project") constructed by Zhuhai Yuexin Semiconductor Co., Ltd. with an investment of 3.5 billion yuan will enter the production stage as scheduled. Among them, the B1 plant is officially started to install and enters the equipment commissioning stage, and some workshops in the A1 plant are conducting equipment installation. According to the construction progress, it is expected that the project will be fully completed by the end of 2024, and the annual output value will reach 3.5 billion yuan at that time.
It is reported that Zhuhai Yuexin Semiconductor Co., Ltd. is a wholly-owned subsidiary of Zhuhai Yueya Semiconductor Co., Ltd. (hereinafter referred to as "Yueya semiconductor"). Zhuhai Yuexin project is invested by Yueya semiconductor with 3.5 billion yuan to build three plants in Zhuhai Fushan Industrial Park and expand the production and manufacturing project of high-end RF and FCBGA packaging carrier board. The foundation of the project was laid on December 8, 2021. The B1 plant was capped on January 28 this year and the equipment was installed on July 5.
In addition, according to the official website of Yueya semiconductor, the company started the construction of Nantong Yueya Semiconductor Co., Ltd. ("Nantong Yueya") in 2019. Nantong Yueya project plans to invest a total of about 3.7 billion yuan to build a new integrated circuit packaging carrier board manufacturing base and a new technology development and service center. The project will start production in the first half of 2020.
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