Source: interface news

    It was reported on April 26 that Denso and usjc, a Japanese subsidiary of liandian, jointly announced today that the two companies have agreed to cooperate in the production of automotive power semiconductors at usjc‘s 12 inch wafer factory to meet the growing demand of the automotive market. Usjc will build an IGBT production line for Denso.

    Liandian said that Denso will provide its system oriented IGBT components and process technology, while usjc will provide the manufacturing capacity of 12 inch wafer factory. It is expected to achieve the mass production of IGBT process in 12 inch wafer in the first half of 2023.

    "Denso is pleased to be one of the first companies in Japan to start mass production of IGBT on 12 inch wafers. With the development of mobile technology, including automatic driving and electrification, semiconductors are becoming more and more important in the automotive industry. Through this cooperation, we have contributed to the stable supply of power semiconductors and vehicle electronics," said koji Arima, Denso‘s president and CEO

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