Techweb reported on May 5 that lattice core and the U.S. Department of defense signed a $117 million agreement to provide the U.S. Department of defense with semiconductor chips manufactured on a differentiated 45nm SOI platform. These chips will be used in sensitive applications in the U.S. defense and aerospace fields. The first chips are expected to be delivered in 2023.
It is reported that under the agreement, the chip manufacturing will be transferred from Fab 10 in East Fishkill, New York, to Fab 8 in Malta, New York. In addition to providing uninterrupted supply to the Ministry of defense, this will also enable lattice core to continue to supply customers with chips manufactured by its 45nm SOI platform after Fab 10 is acquired by ansenmey.
Tom Caulfield, CEO of lattice core, said in a press release, "This new supply and technology transfer agreement demonstrates a strong public-private partnership, which is an excellent example of how federal cooperation and investment in semiconductor manufacturing can have an impact on strengthening domestic supply chains. Our partnership promotes the national economy and ensures the strategic and reliable supply of chips needed by the U.S. government in aerospace, defense and other mission critical applications."
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