On June 1, according to foreign media reports, Foxconn expects that its wafer plant focusing on automotive chips and next-generation semiconductors will be put into operation in 2023.
Liuyangwei, chairman of Foxconn, talked about the new goals in electric vehicles, semiconductors and next-generation network communications in the next three years at the general meeting of shareholders. He stressed that the target of 10% gross profit margin in the medium and long term would remain unchanged. In terms of the internal production of key automotive chips, Liu Yangwei disclosed that the mass production of silicon carbide for vehicle chargers will begin in 2023, and the mass production of silicon carbide power modules for optical phased array lidar and inverter will begin in 2024.
Foxconn plans to start mass production of 8-inch wafers and 6-inch wafers for automotive chips in 2023, and trial production of 6-inch silicon carbide wafers in 2023. In terms of semiconductors, liuyangwei disclosed that they will continue to promote the layout in the semiconductor field according to the 3+3 strategy, not only to expand production capacity, but also to increase research and development in automotive semiconductor products, and set up research institutions to help promote the next generation of technology plans.
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